KOREA TECHNOLOGY AND FUTURE 제품소개

2U

KR580S3
최신 4세대 인텔® 제온® 스케일러블 프로세서가 탑재된 2소켓 서버

이전 세대 대비 더 높은 성능, 안정성, 확장성 및 보안성은 물론 가속화를 지원하는 랙 서버입니다.

다양한 최신 IT 기술 지원을 통해 기업 IT, 데이터센터, 클라우드 환경, AI/ML 및 Big Data 분석 등과 같은 고성능 컴퓨팅 워크로드를 수행하는데 이상적인 서버입니다.

Form Factor 

2U Rackmount

CPU 
2x 4th Generation Intel® Xeon Scalable Sapphire Rapids Processors (up to 350W TDP)

Memory 
32x DDR5 LR/R DIMMs (up to 8TB), Max. Speed 4800 MT/s

Disk (Optional)
8S: 8x SAS/SATA hot swap drive bay 
12S: 12x SAS/SATA hot swap drive bay 
24S: 24x SAS/SATA hot swap drive bay
8T4S: 8x SAS/SATA/NVMe tri-mode, 4x SAS/SATA hot swap drive bay
16S8N: 16x SAS/SATA, 8x NVMe hot swap drive bay
8S16N: 8x SAS/SATA, 16x NVMe hot swap drive bay
24N: 24x NVMe hot swap drive bay

Network & Expansion slot
Onboard: 1x 1GbE(RJ45)
PCIe Slot: 2x PCIe x16 Full Height, 4x PCIe x8 Full Height, 2x PCIe x8 Low Profile, 1x PCIe x16 OCP3.0
 
Front I/O 
1x USB3.0, 1x USB2.0, 1x VGA
Power/Reset/UID Button
Power/Status/UID/LAN LEDs

Rear I/O 
1x VGA, 1x Serial Console (RJ45 type)
1x Onboard LAN, 1x IPMI for Mgmt.
3x USB3.0
UID LED, BMC Reset Button

Management
IPMI2.0 Compatible (AST2600)
1x Dedicated Mgmt. RJ45
1x Shared Mgmt. RJ45

GPU accelerators 
2x Double Slot GPU accelerators Support

Cooling
6x 60mm hot swap capable system Fan
1U Extended Volume Air Cooling HeatSink (EVAC) - CPU TDP up to 205W
2U Extended Volume Air Cooling HeatSink (EVAC) - CPU TDP up to 350W

Power
2x CRPS Modules (1+1 Redundant PSU)
1300W 80PLUS Platinum
1600W 80PLUS Platinum
2000W 80PLUS Titanium

Dimensions 
777.3(D)mm x 447.6(W)mm x 87(H)mm